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| SELECTOR GUIDE |
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| Semiconductor Product Selector Guide |
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Process Type |
Typical Seal Temperature |
Typical Process Environment |
Suggested Products |
Comments |
Typical Applications |
Plasma Processes |
HDPCVD/
PECVD/
SACVD |
25-250oC |
TMS, TEP, TEBO
TEOS, SiH4
NH3, SiF4
O2, O3, N2O
NF3, CF4, C2F6 |
9100
8085
8002 |
9100-Optimum for deposition process applications. Low erosion rate and ultra-low particle generation in oxygen and fluorine-based plasmas. Excellent elastic recovery properties.
8085-General purpose product for all plasma processes. Excellent mechanical strength properties.
8002-Transparent product for "select" plasma process applications. Ultra-low particle generation in oxygen and fluorine-based plasmas. |
Dynamic:
- Door seals
- Gate valves
- Pendulum valves
- Lip seals
Static:
- Chamber lid seals
- Electrode seals
- Lamp seals
- Exhaust valves
- Gas inlets/outlets
- Window seals
- Center rings
- Fittings
Carrier:
- Wafer/
FPD Support/
Transport |
| PVD |
25-250oC |
High Vacuum
Ar, N2 |
Metal CVD
ALD |
25-250oC |
WF6, SiH4
Organic Precursors
H2, N2, O2
TiCl4, NF3 |
| Etching |
25-220oC |
CF4, C3F8, CHF3
SF6, O2, H2, HBr
BCl3, CCl4, Cl2 |
9100
8085
8002 |
Ashing/
Stripping |
25-250oC |
O2, CF4, CHF3, NH3
H2O Vapor
Forming Gas |
Thermal Processes |
LPCVD/
ALD |
150-300oC |
NH3, HCl
SiH4, SiH2Cl2
H2O Vapor, O3 |
7075UP
8475 |
7075UP-Optimum for LPCVD, ALD, oxidation and diffusion thermal process applications.
8475-Optimum for lamp anneal and RTP thermal process applications. |
- Quatz Chamber seal
- Fittings
- Center ring
- Plenum seals |
Oxidation/
Diffusion |
150-300oC |
N2, O2
H2O, HCl |
Lamp Anneal
RTP |
150-300oC |
Resistance to IR absorption/ low outgassing |
8475 |
Wet Processes |
Wafer Prep,
Cleaning,
and Rinsing |
25-125oC |
UPDl, Piranha
SC-1, SC-2, O3
HF(49%) |
6375UP
4079 |
6375UP-Optimum for wet process applications.
4079-Excellent chemical resistance.
1050LF-Excellent amine resistance. |
- Door/lid seals
- Drain seals
- Seals for chemical containers
- Fittings
- Seals for filters/ connectors
- Flow meters |
| Etching |
25-180oC |
HNO3, HF, H2O
H3PO4, HNO3
Acetic, H2O |
| Photolithography Developing and Rinsing |
25-125oC |
H2SO4 + Oxidant
Organic Acids
NaOH, TMAH
Xylene, nMP |
| Stripping |
25-125oC |
nMP/Alkanolamine
Hydroxlamine |
6375UP
1050LF |
| Copper Plating |
25-100oC |
CuSO4 Solution
H2SO4, H2O2
UPDI
Citric Acid |
6375UP |
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